NY6600
低介電常數(shù)(Dk 3.90@3.5GHz，諧振環(huán))
介質(zhì)損耗(Df 0.004@10GHz)
Tg >200℃ 高耐熱性
優(yōu)異通孔可靠性及 PCB 加工性
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載板功放Carrier plate power amplifier
NY6600 基板產(chǎn)品規(guī)格表 Specification Sheet for Laminate
| NY6600ANT覆銅板 NY6600ANT Laminate | 測試方法 Test Method | 測試條件 Test Condition | 單位Units | 典型值 Typical Value |
| IPC-TM-650 | Metric(English) | 1.524mm CCL | ||
| 玻璃態(tài)轉(zhuǎn)換溫度Tg Glass Transition Temperature | 2.4.24.4 | DMA | ℃ | 240 |
| 2.4.24 | TMA | ℃ | 220 | |
| Z軸膨脹系數(shù) Z-axis CTE A. 50 to 260 ℃ | 2.4.24 | TMA | % | 0.95 |
| X/Y軸膨脹系數(shù) X/Y-axis CTE A. 50 to 125℃ | 2.4.24 | TMA | PPM/℃ | 10/10 |
| 熱分解溫度Td Decomposition Temperature | TD (5% wt loss) | — | ℃ | 410 |
| 耐熱性(除去銅箔) Thermal Resistance (Copper removed) A.T288 B.T300 | 2.4.24.1 | TMA | Minutes Minutes | > 60 > 60 |
| 介電常數(shù) Dk Permittivity | Ring Resonator | 3.5 GHz/23℃ | — | 3.90 |
| 介質(zhì)損耗Df Loss Tangent | SPDR | 10 GHz/23℃ | Maximum | 0.0040 |
| 吸水率 Water Absorption | 2.6.2.1 | — | % Maximum | 0.13 |
| 剝離強度 Peel Strength | 2.4.8 | Hoz RTF | N/mm(lb/inch) | 0.6 (3.5) |
| 體積電阻 Volume Resistivity | 2.5.17.1 | — | MΩ-cm Minimum | ＞10×1010 |
| 表面電阻 Surface Resistivity | 2.5.17.1 | — | MΩ Minimum | ＞10×109 |
| 抗拉強度 Tensile strength | GB/T 1040.1-2018 | — | MPa | 210/210 (徑/緯) |
| 彎曲強度 Flexural strength | 2.4.4.1B | — | MPa | 400/425 (徑/緯) |
| 拉伸模量 Tensile Modulus | GB/T 1040.1-2018 | — | Gpa | 18/18 (徑/緯) |
| 泊松比 Poisson's Ratio | GB/T 1040.1-2018 | — | μb | 0.2/0.2 (徑/緯) |
| 耐燃性 Flame Resistance ( Laminate & Prepreg as laminated) | UL94 | — | Rating | V-0 |
